碳化硅（第三半导体核心材料，产业链龙头全梳理）
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<p data-track="1" style="box-sizing: border-box; margin-bottom: 20px; padding: 0px; border: 0px; color: rgb(34, 34, 34); font-family: "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei", "WenQuanYi Micro Hei", "Helvetica Neue", Arial, sans-serif; font-size: 18px; text-align: justify; white-space: normal; background-color: rgb(255, 255, 255); margin-top: 0px !important;"><span style="box-sizing: border-box; font-weight: 700; margin: 0px; padding: 0px; border: 0px;">查行业数据，就用【行行查】！<a class="pgc-link" data-content="mp" data-source="outerLink" href="https://www.hanghangcha.com/?hmsr=toutiao" rel="noopener noreferrer noopener noreferrer" target="_blank" style="box-sizing: border-box; background-color: transparent; cursor: pointer; text-decoration-line: none; color: rgb(64, 101, 153); margin: 0px; padding: 0px; border: 0px;">行行查 | 行业研究数据库</a></span><br style="box-sizing: border-box;"/></p><p data-track="79" style="box-sizing: border-box; margin-top: 20px; margin-bottom: 20px; padding: 0px; border: 0px; color: rgb(34, 34, 34); font-family: "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei", "WenQuanYi Micro Hei", "Helvetica Neue", Arial, sans-serif; font-size: 18px; text-align: justify; white-space: normal; background-color: rgb(255, 255, 255);">半导体材料作为电子信息技术发展的基础，经历了数代的更迭。以碳化硅、氮化镓为代表的第三代半导体材料逐渐进入产业化加速放量阶段。</p><p data-track="20" style="box-sizing: border-box; margin-top: 20px; margin-bottom: 20px; padding: 0px; border: 0px; color: rgb(34, 34, 34); font-family: "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei", "WenQuanYi Micro Hei", "Helvetica Neue", Arial, sans-serif; font-size: 18px; text-align: justify; white-space: normal; background-color: rgb(255, 255, 255);">碳化硅（SiC）是第三代半导体材料的核心。相较于前两代材料，碳化硅具有耐高压、耐高温、低损耗等优越性能，具有较高的导热率、熔点等。<a class="tteditor-forum" data-name="碳化硅" data-uid="" data-id="1633916664250381" data-concern-id="1633916664250381" rel="noopener noreferrer" style="box-sizing: border-box; background-color: transparent; cursor: default; margin: 0px; padding: 0px; border: 0px;">#碳化硅#</a></p><div class="pgc-img" style="box-sizing: border-box; margin: 18px 0px; padding: 0px; border: 0px; color: rgb(34, 34, 34); font-family: "PingFang SC", "Hiragino Sans GB", "Microsoft YaHei", "WenQuanYi Micro Hei", "Helvetica Neue", Arial, sans-serif; font-size: 18px; text-align: justify; white-space: normal; background-color: rgb(255, 255, 255);"><img src="https://p3.toutiaoimg.com/origin/tos-cn-i-qvj2lq49k0/cd28eae9ca264ffda19146a6750cb671?from=pc" img_width="1306" img_height="830" alt="碳化硅：第三半导体核心材料，产业链龙头全梳理" inline="0" class="syl-page-img" style="box-sizing: border-box; border: 0px; margin: 0px auto 8px; padding: 0px; cursor: zoom-in; max-width: 100%; display: block; border-radius: 4px; height: auto;"/><p class="pgc-img-caption" style="box-sizing: border-box; margin-top: 0px; margin-bottom: 0px; padding: 0px; border: 0px; position: relative; text-align: center; font-size: 14px; line-height: 20px; color: rgb(153, 153, 153);">资料来源：Yole</p></br>微信搜索公众号【深圳家】或者直接搜索【i-shenzhen】，获取更多信息
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